Integrate Heterogenous Ssn with airSlate SignNow

Integrate heterogenous ssn

hello everyone welcome back to another video today we're looking at video nine and we're going to be talking about heterogeneous integration innovation now this is the part one we will have another video coming up soon but today we're going to be focusing on interconnections for heterogeneous integration my name is alonso thanks for joining me today and i hope you guys enjoy the video so what is heterogeneous integration uh it's basically the term is thrown out a lot and it can be a little bit confusing but you know when it comes down to it it's just the integration of separate components into a higher level assembly with sap so you're supposed to be or you know it means that you're mixing different functionality you're mixing different chips into one single chip in one single package and as we can see over here in this picture in the top right uh we have different chips that have been manufactured separately in different fabs and then we're just bringing all of those together and put them in uh putting them into the same package under the same you know substrate they're all interconnected and they don't need to be connected to anything else through a pcb for example and they they are usually able to perform a whole a whole systems worth of functionality just the one chip what this brings you is enhanced functionality and operation and also a higher density of transistors chips or ios in this case the the chips are placed much closer together so you get a higher density of chips and you're also able to stack them vertically in a 3d architecture that gives you much much higher density in terms of uh footprint for both transistors you know chips and also the ios which is what we'll focus on later uh like i said in a way it works a little bit similar to a pcb because you no longer need to connect the chips onto the pcb and have them all spread out you can just like have all of the functionality that you would previously have in a board now you can have it in a chip and as you guys can see down here that also reduces the size making it much more efficient um more dense and overall just better so it's probably that we'll see that in the future a lot of the chips will try to especially for for small devices will try to shift a little bit more towards these heterogeneous integration chips uh some of the applications for these some of the main ones can be the automotive industry the medical field or handheld devices but you can see applications for hi on wearables advanced computing ai airspace gaming you name it anything that has advanced computing uh could definitely use some heterogeneous integration chips so we wanted to mention a little bit about the architecture how how do these chips come together...